Cryolipolysis cool shape machine is a new, non-invasive way to gently and effectively reduce fat in targeted areas of the body that results in a noticeable,natural-looking fat reduction in the treated areas.
Triglyceride in fats will be converted into solid in particular low temperatures. What makes the Cryolipolysis cool shape machine procedure different is that it uses advanced cooling technology to selectively target fat bulges and eliminate fat cells through a gradual process that does not harm the surrounding tissues.
This procedure can reduce unwanted abdominal fat, love handles (flanks), and back fat. When fat cells are exposed to precise cooling, they trigger a process of natural removal that gradually reduces the thickness of the fat layer. And the fat cells in the treated area are gently eliminated through the body’s normal metabolism process, to eliminate unwanted fat.
Through the freezing effect, remove the fat cell triglyceride off heat, and will remain at 4 ℃, so the cold coagulation, and therefore premature aging and death. Fat cells in the cold, it will start clearing the natural decomposition process, so that gradually thinner fat layer. Through the normal metabolic processes, decreasing the fat layer, to achieve the purpose of partial melting fat. Fat cells can be significantly reduced, the fat layer also will become thinner, so that the fat blocks will be killed one by one.
Cooling Skin protection while lifting and tightening. The contact cooling of the hand piece surface regulates the temperature of the skin and protects fine dermal structures, realizing the fast body-reshape effects while tightening skin!
Accessories List:
Specifications
| Input Power | 1800W |
| Frozen head pressure | 0-100kpa |
| RF energy | 1-50J/cm2(optional) |
| Cavitation energy | 1-70J/cm2(optional) |
| Frozen head operation screen size | 3.5 Inch |
| RF frequency | 10M(optional) |
| Cavitation Frequency | 40K (optional |
| Treatment handle’s quantity | 5units( Optional) |
| Touch screen size | 10.4 Inch |
| Frozen head temperature | -15-5℃ |
| Cooling System | Semiconductor Cooling + water-cooling + air cooling |
| Dimension | 435*400*1200mm |
| Net weight | 35kg |
| Fuse specification | Ø5×2510A |
| Power | AC220V±10%,10A,50HZ / AC110V±10%10A,60HZ |
